Colloidal Processing of Temperature Shock Resistant SiC with Tailored Porosity

Colloidal Processing of Ceramics

Colloidal processing of ceramics is reviewed with an emphasis on interparticle forces, suspension rheology, consolidation techniques, and drying behavior. Particular attention is given to the scientific concepts that underpin the fabrication of particulate-derived ceramic components. The complex interplay between suspension stability and its structural evolution during colloidal processing is h...

Thermal shock and oxidation resistant gradient coating based on yttrium silicate for C/SiC composite

Yttrium silicate coating[5, 6] is a promising candidate for oxidation resistant coating for its low oxygen diffusion coefficient and similar thermal expansion coefficient with silicon carbide. Webster et. al.[7] had prepared yttrium silicate coating on C/SiC using Y2O3/SiO2 slips by slip casting and sintering. The selected sintering parameters were 3 h at 1600 °C in flowing argon. The coating c...

Surface charges and optical characteristic of colloidal cubic SiC nanocrystals

Colloidal cubic silicon carbide (SiC) nanocrystals with an average diameter of 4.4 nm have been fabricated by anisotropic wet chemical etching of microsized cubic SiC powder. Fourier transform infrared spectra show that these cubic SiC nanocrystals contain carboxylic acid, SiH, CH, and CHx groups. UV/Vis absorption and photoluminescence (PL) spectroscopy clearly indicate that water and ethanol ...

Temperature - Induced Direct Casting of SiC

High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing

Wafer backside processing steps that include high temperature exposure may now be simplified with the use of a thermally resistant adhesive, GenTak 330. Processing at temperatures of 200oC and beyond are accepted to include plasma etching, deposition, and the curing of related polymers, such as BCB. By combining the thermoset properties of GenTak 330 with the dissolution characteristics of GenS...